The chip is very strict in packaging technology. In order to prevent the air impurities from causing corrosion to the chip circuit and affect its performance, the advanced technology of packaging is particularly critical in the packaging process. Through the advanced packaging technology, the chip is connected with the external circuit to protect the inside of the chip, enhance the thermal conductivity, and give full play to the chip performance to a greater extent.

Technology trends

With the popularity of 5G mobile communication and the rise and wide application of artificial intelligence, intelligent devices need chips with faster transmission speed, larger storage capacity, higher security, finer precision and stronger stability.

    Yield advantage and high quality products

SCY’s application in BGA technology is very mature. The packaging yield of 8-fold storage products is as high as 99.99%, reaching the original factory level. The packaging rate ranks first in China. It provides high-quality storage solutions to high-speed, large-capacity and low-power embedded applications and Internet of things applications. At the same time, SCY has the advantage of small size packaging of chips, which can reduce power consumption and improve the anti-interference performance of the chip, so as to serve the production of ultra-high-density and ultra-small consumer electronic chips.

BGA technology features

BGA technology provides the best choice to high density, high performance, multi pin and large capacity package. In the process of packaging, coplanar welding is used to greatly improve the reliability of the package. The signal transmission delay of the package chip is small, which is helpful to improve the product adaptation frequency. Moreover, the number of I / O pins of this technology is increased, the distance between pins is far, and the assembly yield is improved; The controllable collapse chip method is used for welding to improve the electrothermal performance, making the product package more compact and more suitable for large-capacity memory chips.