High stability and integrated mass storage eSSD
eSSD complies with SATA3.0 specification with SATAIII 6.0Gbps interface that is compatible with 6.0Gbps /3.0Gbps/1.5 Gbps. It is a high-performance, large capacity integrated solid-state disk chip solution.
The package size of the 313-ball BGA is 30.0mm*40.0mm*3.0mm. It’s encapsulated by SIP package technology also supports 256GB~1TB capacity.
The 104-ball BGA package size is 14.0mm*18.0mm*1.8mm. The chip adopts multi-layer packaging technology and supports 32GB~128GB capacity. Compared with traditional SSD, the size of eSSD is smaller, more capacity in one chip, and higher reliability. The ultimate compact size is to eliminate burden of end devices and enables its design more flexible. The design supports MLC and pSLC Nand that has high stability. Even in various vibration conditions, it can ensure stable operation. It perfectly fits requirements of drones, ultrathin laptop, rugged laptop, industrial control and other end devices
2020,11,30
On November 27, the winter sun was warm and the wind was cool. Nearly 30 elite entrepreneurs from the third class of "New Cantonese Business" Tsinghua University Advanced Training Class, accompanied by Li Jintai, Deputy Secretary-General of the
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2020,11,14
On November 12, the epidemic was like a tiger but could not withstand the heat of the storage industry. The "2021 Storage Industry Trend Summit (MTS2020)" hosted by TrendForce Consulting was held in Shenzhen. Many industry leaders and experts in
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2020,11,06
On November 3, the first electronica South China opened at the Shenzhen International Convention and Exhibition Center (Bao’an New Hall). Shenzhen Shichuangyi Electronics Co., Ltd. was invited to participate in the exhibition, bringing its flagship produc
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