Memory chips supporting multiple wafers
Follow JEDEC JESD230C international standard, standard package 132/252-ball BGA, support 32GB~1TB capacity segment, and support the original mainstream wafer. It can package 1-16 wafers in one particle. Products are divided into single channel, double channels and four channels. Single channel and dual channel Nand is suitable for U disk and SSD; Four-channel Nand is suitable for M.2 2230 SSD product.
PC
SSD
Data center
USB Flash Drives
2020,11,30
On November 27, the winter sun was warm and the wind was cool. Nearly 30 elite entrepreneurs from the third class of "New Cantonese Business" Tsinghua University Advanced Training Class, accompanied by Li Jintai, Deputy Secretary-General of the
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2020,11,14
On November 12, the epidemic was like a tiger but could not withstand the heat of the storage industry. The "2021 Storage Industry Trend Summit (MTS2020)" hosted by TrendForce Consulting was held in Shenzhen. Many industry leaders and experts in
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2020,11,06
On November 3, the first electronica South China opened at the Shenzhen International Convention and Exhibition Center (Bao’an New Hall). Shenzhen Shichuangyi Electronics Co., Ltd. was invited to participate in the exhibition, bringing its flagship produc
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