Eco-industrial chain

Continuously upgrade to ensure
the excellent quality of all products and services

Research and development cooperation

  • Independent development and testing verification

    — Senior R&D and testing team


    — Design-win projects experience for major clients


    — Mainstream wafer fab adaptation and main control chip 


    — Standardized testing and verification process


  • High speed hardware design and modeling simulation

    — Multi type hardware packaging design


    — Significantly reduce design iteration cycles


    — Scheme design for multi scenario applicability


    — Diversified modeling and simulation techniques

  • Fully self-developed advanced packaging technology

    — Second generation FlipChip advanced packaging technology


    — 16-layer stacked Die packaging process


    — 99.9% comprehensive product yield             


    — 99.9% comprehensive product yield


  • High-speed automated testing equipment

    — Special R&D technical team                                


    — Typical service project experience

     

    — Diversified testing functions                          

      

    — Highly automated and programmable


Talent introduction

  • Jointly set up a domestic storage laboratory with Shenzhen University

       In 2019, SCY and Shenzhen University jointly established a domestic storage laboratory.


       More than 30 graduate students and tutors from the School of Computer and Software of Shenzhen University and our R&D team carried out in-depth research work in the design of UFS master chip and software algorithm of embedded memory products based on the application field of high-end smart phone platform.


      It aims to build the most authoritative memory chip characteristic analysis laboratory in China, and contribute to the localization of domestic memory master chip.

  • SCY & HIT (Shenzhen) the second "Chuangxin Cup" finals core star shine

         The second "Creation Cup" competition focuses on the theme of "Innovative Design based on non-volatile storage products". Each team is free to choose any of the embedded non-volatile storage products (including NAND Flash, eMMC, SD, UFS) of the Time creative brand, and can obtain all the technical documentation provided by the Time Creative technology review team. Since the start of the competition on June 12, after a rigorous selection and review of auditions and mid-term judging, seven participating teams finally stood out and entered the finals.

        The final will be held in the form of "road show + defense". Each team will have 20 minutes to explain the innovative plan, on-site demonstration of the work and interactive defense. The representatives of each team will display the results of the design background, technology realization path, product development highlights and industrial application prospects of the plan. The judges asked questions from the aspects of correctness, innovation, application value and standardization of the design works.

        After fierce competition, "Core Language Core Yu team" finally won the first prize of this competition by virtue of the stable play in the audition, mid-term review and finals, as well as the outstanding advantages in the practicability and innovation of the program! "No name team", "disorderly number team" won the second prize, the rest of the final team won the third prize and excellence award. The first prize is 30,000 yuan per group, the second prize is 20,000 yuan per group, and the third prize is 10,000 yuan per group.

Innovation cooperation

With the continuous breakthrough of innovation and R & D of the company, SCY has continuously enhanced the layout of intellectual property rights such as invention patents and software copyright. From 2016 to 2020, the company's patents have increased