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Research and development cooperation

  • Independent development and testing verification

    — Senior R&D and testing team


    — Design-win projects experience for major clients


    — Mainstream wafer fab adaptation and main control chip 


    — Standardized testing and verification process


  • High speed hardware design and modeling simulation

    — Multi type hardware packaging design


    — Significantly reduce design iteration cycles


    — Scheme design for multi scenario applicability


    — Diversified modeling and simulation techniques

  • Fully self-developed advanced packaging technology

    — Second generation FlipChip advanced packaging technology


    — 16-layer stacked Die packaging process


    — 99.9% comprehensive product yield             


    — 99.9% comprehensive product yield


  • High-speed automated testing equipment

    — Special R&D technical team                                


    — Typical service project experience

     

    — Diversified testing functions                          

      

    — Highly automated and programmable


Talent introduction

  • Jointly set up a domestic storage laboratory with Shenzhen University

    In 2019, SCY and Shenzhen University jointly established a domestic storage laboratory.


    More than 30 graduate students and tutors from the School of Computer and Software of Shenzhen University and our R&D team carried out in-depth research work in the design of UFS master chip and software algorithm of embedded memory products based on the application field of high-end smart phone platform.


    It aims to build the most authoritative memory chip characteristic analysis laboratory in China, and contribute to the localization of domestic memory master chip.

  • Jointly held the first and second Chuangxin Cup competition with HIT

    Since the contest was launched on October 19, 15 teams fought hard to compete and were evaluated by expert judges based on the correctness, innovation, application value and standardization of the works, and finally selected 6 teams to enter the finals.


    After nearly 2 hours of wonderful competition, "Band-Aid core team" finally stood out, the team's preliminary design, the second round of the road show defense score is the first place, and therefore won the first prize of the first "Chuangxin Cup" competition, the rest of the final team won the second and third prizes. Among them, first prize each group of 40,000 yuan bonus, second prize each group of 20,000 yuan bonus, third prize each group of 10,000 yuan bonus.

Innovation cooperation

With the continuous breakthrough of innovation and R & D of the company, SCY has continuously enhanced the layout of intellectual property rights such as invention patents and software copyright. From 2016 to 2020, the company's patents have increased