The 33rd JAPAN IT WEEK2024 SPRING will be held on April 24-26 at Tokyo Big Sight. SCY will bring a full range of products such as SSD, DRAM, embedded storage chips and mobile storage products to the exhibition at booth No.30-34 in East Hall. At that time, we will share cutting-edge innovations technologies and industry-grade solutions of storage, and endeavor to continuously promote storage progress under the wave of intelligence.

SCY will focus on displaying a variety of main SSD products represented by S7000 Pro, S7000, C7000, S5000, etc. The series products combine excellent performance and massive storage，and have the characteristics of stable compatibility, reliable quality and excellent temperature control. it integrates HMB, FW temperature control mechanism, 4K LDPC error correction engine, end-to-end data protection and other special functional solutions, personalized product portfolios and technology modules can be configured to provide a variety of storage choices for various smart terminals such as laptops, gaming devices and game handhelds.Taking the S7000 for example, it uses PCle 4.0x4 high-speed interface,with sequential read and write speeds of up to 7400MB/s and 6600MB/s respectively, and has 4TB of massive storage space. For more information, please visit our booth.

As the leading and largest exhibition in the IT industry, the 33rd Japan Spring IT Week covers 12 themes, including Embedded Systems, Data Center & Storage, IoT/5G Solutions, (Computer) Virtual Reality, and metaverse, aiming to build a professional and efficient trade platform for global exhibitors to expand their markets.

When the cherry blossoms are blooming, We look forward to meeting you at the event, matching you with high value-added,cost-effective storage products and high-quality services with strong product power, international standard product control system, advanced production technology and in-depth customized solutions, and promoting the prosperity and development of the IT industry with global industry chain partners.